Speckle Interferometry  (selection)

Journals (97-99):   Steinchen W., Yang L.X., Kupfer G., Mäckel P. und Vössing F: Digital-shearografische Schwingungsanalyse von harmonisch beanspruchten Bauteilen, Technisches Messen 66 (1999) 2, R. Oldenburg Verlag

Steinchen W., Yang L.X, and Mäckel P.: Strain analysis by digital shearography: potentials, limitations and applications,  Journal of strain analysis,  33 (1998) 2, p 171 - 182.  

Steinchen W.,. Yang L.X, Kupfer G., Mäckel P. and Vössing F.: Nondestructive Testing of Aerospace Composite Materials using digital Shearography,  Journal of Aerospace Engineering, 212 (1998), p. 21-30

Yang L.X., Steinchen W., Mäckel P. and Kupfer G.: Vibration analysis by digital shearography,  Optical and Lasers in Engineering,  (30) 1998  

Steinchen W., Yang L.X., Kupfer G., Mäckel P. und L.B. Vogelesang: Bildgebende Phasenschiebe-Shearografie,  Materialprüfung, 40 (1998) 7/8,  S. 298 – 301.  

Steinchen W., Kupfer G., Yang L.X., Mäckel P.: Dynamisch belastete Bauteile zerstörungsfrei prüfen,  Materialprüfung 39 (1997) 3, S. 91-95  

 
Conference publications 

and 

proceedings 
( June 97-98)  

 

 Steinchen W., Yang L.X., Kupfer G., Mäckel P. und Vössing F.: Digital shearography for dynamic analysis,  Proceeding of the International Symposium of Advanced Optical Methods and Application in Solid Mechanics, Aug. 31–Sep. 04, 1998, Poitiers, France  

Steinchen W., Yang L.X., Mäckel P. und Vössing F.: Vibration measurement by digital shearography, Proc. of 11th Intern. Conference on Experimental Mechanics, Aug. 24–28, 1998, Oxfond, UK  

Steinchen W., Yang L.X., Kupfer G., Mäckel P., Vössing F.: Laser diodes in digital speckle pattern and speckle pattern shearing interferometry,  SPIE’s Intern. Symposium: Lasers and Materials in Industry, Proc. of SPIE Vol. 3415, 13–16 July 1998, Québec, Canada  

Steinchen W., Yang L.X.,  Kupfer G., Mäckel P., Vössing F.: Digital-shearography for strain measurement: an analysis of measuring errors,  SPIE’s 43rd Annal Meeting,  Proceedings of SPIE Vol. 3479,  19 – 24 July 1998,  San Diego,  California, USA.  

Steinchen W., Yang L.X., Kupfer G., Mäckel P. and Vössing F.:: Vibration analysis by means of digital speckle pattern interferometry, Proceeding of Photo Mécanique 98,  Apr. 14 – 16, 1998,  Marne-la-Vallée,  France,  S. 171 –182.  

Steinchen W., Yang L.X.,  Mäckel P., Thiemich A.: Vibration analysis by digital speckle pattern shearing interferometry,  SPIE (Proc. of the Intern. Society for Optical Engineering) Vol.3098, June 1997, München  

Steinchen W., Yang L.X., Kupfer G., Mäckel P.: Nondestructive testing of micro-cracks using digital speckle pattern shearing interferometry,  SPIE (Proceedings of the International Society for Optical Engineering) Vol. 3098,  June 1997, München