We measure or test for you e.g. on shot-peened, hard-rolled, turned, milled, ground or heat-treated components.
X-ray residual stress measurement, application of the borehole method after shot peening, deep rolling, grinding, turning, milling, quenching and tempering, etc.
ZERTECH has more than 10 different stationary and mobile X-ray diffractometers for residual stress, texture and phase analysis.
For measuring residual stresses on samples and components, measuring devices in psi or omega arrangements are used, depending on the object size. Devices with chromium and copper radiation are constantly in use. In addition, the following anode materials can be installed: Co, Fe, Mo. Appropriate machines are available for sample taking or sample preparation. To measure residual stress depth distributions, material volumes are removed step by step by electrochemical ablation and measured on the newly created surface.
Measurement of Ra, Rz, Rt; crack detection; imaging in scanning electron microscope
S-N curves derived from tests on specimens and components under tension/compression, bending, torsion at RT or elevated temperature; determination of residual stress stability; thermal fatigue
Hardness measurement according to HV, HB, HRC; micro hardness measurement according to Vickers and Knoop; universal hardness determination with forces from 0.4 mN to 10 N
Vibration corrosion cracking in seawater and in spray during flexural fatigue and recirculating bending, potentiometric current density measurement
Residual austenite and texture determination by X-ray diffraction, EDX and WDX in SEM
Determination of plastic strain amplitude of stress-strain hysteresis, of cyclic stress-strain curves and of alternating deformation curves
Classical metallography, reflected light and scanning electron microscopy; image processing